We put at your disposal a group of first-class professionals with proven experience in the electronic assembly sector and we have state-of-the-art technology (Samsung machinery) with capacity for 28,000 CPH, for the assembly of multilayer boards, and components SOT, TSOP, QSOP, VSOP, PLCC, LQFP, QFN, BGA, LFBGA, LED, etc., with the possibility of flexible manufacturing, integration and testing of the product.
The SMD assembly, THT, verification and assembly of the PCBs, is carried out in a totally antistatic room, with temperature and humidity environment controlled and monitored at all times.
